Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: The cost of software testing is a significant aspect of the software development life cycle, typically accounting for half of the total software production cost. Due to the large number of ...
This paper presents a generic beamformer design algorithm for arbitrary microphone array geometry. It makes efficient use of noise models for ambient and instrumental and microphone directivity ...
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