LONDON--(BUSINESS WIRE)--Process Systems Enterprise (PSE), a Siemens business, today released its rebranded gPROMS Process advanced process modelling environment. Formerly known as gPROMS ...

A novel parallel computing framework for chemical process simulation has been proposed by researchers from the East China University of Science and Technology and the University of Sheffield. This ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Silicon photonics is an emerging and rapidly-expanding design platform that promises to enable higher-bandwidth communication and other applications. One of the best qualities of silicon photonics is ...

Siemens announced a new Additive Manufacturing (AM) Process Simulation solution for predicting distortion during 3D printing. The product is fully integrated into Siemens’ end-to-end Additive ...

In 2023, as part of its HyMEET strategic project, Cetim acquired a new HySPIDE TP® machine and is still working on the material, manufacturing and design of high-pressure R&D storage tanks development ...