As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified ...
Beyond data centers and high-density computing racks, the air-cooled thermal module is particularly suitable for AI and HPC servers, edge computing modules, distributed computing systems, electric ...
Infineon Technologies released a reference design using the company’s TDM22545D dual-phase OptiMOS power module to address AI server demands. The 10- × 9- × 5-mm power module co-packages two smart ...
Shrinking available board space in next-generation server and telecom system power-delivery applications led to Fairchild Semiconductor’s development of the smart power stage (SPS) module family. The ...
TL;DR: Micron is sampling its new 192GB SOCAMM2 memory module, featuring advanced 1-gamma DRAM technology for over 20% improved power efficiency. Designed for AI data centers, SOCAMM2 offers high ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback