Lam Research BESI Talks Highlight Push Into Advanced Packaging Content

Lam Research (NasdaqGS:LRCX) has reportedly held takeover talks with BE Semiconductor Industries (BESI). The discussions point to potential M&A activity that could affect the semiconductor equipment ...
EDN

Advancing MEMS packaging, assembly, and test for the marketplace

The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...
Machine Design

Pneumatics in Packaging: New Developments for Better Bottles

Many packaging companies are turning to systems that combine the stretch blow molding (SBM) process with the bottling process in a single production flow. Pneumatic technologies can solve PET ...
EDN

Inspection and Test in SMT Assembly Process

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...